CommAgility and Quortus to demonstrate LTE ‘network in a box’ at Mobile World Congress
Based on new AMC module with LTE PHY/stack software
Loughborough, UK, 16 February 2016: At this year’s Mobile World Congress, CommAgility will be showcasing its latest hardware and software products at Stand 7C88. CommAgility’s embedded signal processing and RF modules, and its LTE PHY/stack software, provide compact, powerful and reliable solutions for 4G and 5G mobile network and related applications.
At MWC, CommAgility and Quortus will be demonstrating a ‘network in a box’ solution based around CommAgility’s new AMC-D24AF4-RF2 AdvancedMC module, along with the company’s eNodeB Physical Layer and Protocol Stack software, and a complete LTE Evolved Packet Core (EPC) solution from Quortus, all integrated on the Texas Instruments (TI) TCI6638 System-on-Chip (SoC).
The new AMC-D24AF4-RF2 is a highly integrated AdvancedMC (AMC) card with two wideband RF transceiver channels. The module’s main processor is the KeyStone™ II architecture-based TCI6638 digital signal processor (DSP)/ARM® SoC, which includes eight TMS320C66x+ DSP cores, as well as four ARM Cortex®-A15 cores for higher layer processing. The module also has two C6678 DSPs, plus a large Xilinx Kintex-7 FPGA.
Quortus ECX Core is a fully-featured virtualized LTE core network with advanced features such as integrated VoLTE / SIP voice, S1/X2 handover, dedicated bearers, CS fallback (CSFB), SMS, inter-RAT and SRVCC. Designed to run on a broad range of hardware, from cloud servers to embedded processors such as the TCI6638 processor, ECX Core allows the creation of NiB solutions that function as standalone private networks, or with interconnect to existing MNO infrastructure.
A two-channel variant of CommAgility’s existing AMC-D24AF4-RF4, the AMC-D24AF4-RF2 is designed to support wireless baseband processing and a 2×2 MIMO air interface in radio test systems, small cells, and UEs for standard or specialised LTE and LTE-Advanced systems up to and beyond Release 10.
The AMC-D24AF4-RF2 is available now. For pricing, please contact CommAgility.
Notes to editors:
High resolution photos are available at www.commagility.com/press. If you would like to arrange a meeting with CommAgility at Mobile World Congress, please email email@example.com
CommAgility is an award-winning, world-leading developer of embedded signal processing and radio modules for 4G and 5G mobile network and related applications. We design the latest DSP, FPGA and RF technologies into compact, powerful, and reliable products based on industry standard architectures. Our customers around the world integrate CommAgility products into high performance test equipment, specialised radio and intelligence systems, R&D demonstrators and trial systems. We are highly flexible and work closely with our key customers to meet their technical needs and to support them through development into volume production.
CommAgility was honoured with a Queen’s Award for Enterprise in International Trade in 2013, appeared in the Sunday Times Hiscox Tech Track 100 list of fastest growing technology companies in 2015, and featured in the Deloitte UK Fast 50 in 2013 and 2012. See www.commagility.com.
In March 2015, CommAgility acquired MIMOon GmbH, headquartered in Duisburg, Germany, a leading licensor of LTE Software IP for mobile devices & wireless infrastructure. MIMOon’s portfolio of products includes Physical Layer and Protocol Stack (SmallCellPHY and SmallCellSTACK) for Small Cells, Physical Layer and Protocol Stack for terminals (MobilePHY and MobileSTACK), advanced scheduler for small cells (SmallCellSPECTRUM) and IP development in the areas of advanced PHY algorithms on multi-core SDR platforms.
Tel: +44 (0)115 8412109
Mobile: +44 (0)7958 534731
About the Texas Instruments Design Network
CommAgility is a member of the TI Design Network, a premier group of independent, well-established companies that offer products and system-level design and manufacturing services complementing TI’s semiconductors to a worldwide customer base to accelerate product innovation and time-to-market. Network members provide product design, hardware and software system integration, turnkey product design, RF and processor system modules, reference platforms, software development, proof-of-concept design, feasibility studies, research, certification compliance, prototyping, manufacturing, and product life cycle management. For more information about the TI Design Network, please visit www.ti.com/designnetwork.